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Advanced Materials for Thermal Management of Electronic Packaging Cover Image E-book E-book

Advanced Materials for Thermal Management of Electronic Packaging [electronic resource] / by Xingcun Colin Tong.

Tong, Xingcun Colin. (Author). SpringerLink (Online service) (Added Author).

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  • ISBN: 9781441977595
  • Physical Description: XXI, 550p. 116 illus., 50 illus. in color. digital.
  • Edition: 1.
  • Publisher: New York, NY : Springer New York, 2011.

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Subject: Physics.
Engineering.
Electronics.
Optical materials.
Physics.
Electronic Circuits and Devices.
Optical and Electronic Materials.
Engineering Thermodynamics, Heat and Mass Transfer.
Electronics and Microelectronics, Instrumentation.

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