Catalog

Record Details

Catalog Search

[ 2 filters applied ]

Back To Results
Showing Item 851 of 1029
Lead Free Solder Mechanics and Reliability Cover Image E-book E-book

Lead Free Solder Mechanics and Reliability

Pang, John Hock Lye. (author.). SpringerLink (Online service) (Added Author).

Record details

  • ISBN: 9781461404637
  • Physical Description: electronic
    electronic resource
    access
    remote
    X, 175p. 162 illus. online resource.
  • Publisher: New York, NY : Springer New York, 2012.

Search for related items by subject

Subject: Engineering
Materials
Electronics
Systems engineering
Optical materials
Engineering
Electronics and Microelectronics, Instrumentation
Optical and Electronic Materials
Continuum Mechanics and Mechanics of Materials
Circuits and Systems

Electronic resources

Texto completo

Back To Results
Showing Item 851 of 1029

Additional Resources