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Lead Free Solder [electronic resource] : Mechanics and Reliability / by John Hock Lye Pang.
Pang, John Hock Lye.
(
author.
).
SpringerLink (Online service)
(
Added Author
).
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Record details
ISBN:
9781461404637
Physical Description:
X, 175p. 162 illus. online resource.
Publisher:
New York, NY :
Springer New York,
2012.
Search for related items by subject
Subject:
Engineering.
Materials.
Electronics.
Systems engineering.
Optical materials.
Engineering.
Electronics and Microelectronics, Instrumentation.
Optical and Electronic Materials.
Continuum Mechanics and Mechanics of Materials.
Circuits and Systems.
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