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| 01572nam a22004455i 4500 |
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| 001 | 25962 |
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| 003 | CONS |
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| 005 | 20130725224050.0 |
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| 007 | cr nn 008mamaa |
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| 008 | 111013s2012 xxu| s |||| 0|eng d |
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| 020 | | . |
‡a9781461404637
‡9978-1-4614-0463-7 |
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| 024 | 7 | . |
‡a10.1007/978-1-4614-0463-7
‡2doi |
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| 035 | | . |
‡a(DE-He213)978-1-4614-0463-7 |
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| 050 | | 4. |
‡aTK7800-8360 |
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| 050 | | 4. |
‡aTK7874-7874.9 |
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| 072 | | 7. |
‡aTJF
‡2bicssc |
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| 072 | | 7. |
‡aTEC008000
‡2bisacsh |
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| 072 | | 7. |
‡aTEC008070
‡2bisacsh |
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| 100 | 1 | . |
‡aPang, John Hock Lye.
‡eauthor. |
|---|
| 245 | 1 | 0. |
‡aLead Free Solder
‡h[electronic resource] :
‡bMechanics and Reliability /
‡cby John Hock Lye Pang. |
|---|
| 264 | | 1. |
‡aNew York, NY :
‡bSpringer New York,
‡c2012. |
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| 300 | | . |
‡aX, 175p. 162 illus.
‡bonline resource. |
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| 336 | | . |
‡atext
‡btxt
‡2rdacontent |
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| 337 | | . |
‡acomputer
‡bc
‡2rdamedia |
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| 338 | | . |
‡aonline resource
‡bcr
‡2rdacarrier |
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| 347 | | . |
‡atext file
‡bPDF
‡2rda |
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| 650 | | 0. |
‡aEngineering. |
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| 650 | | 0. |
‡aMaterials. |
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| 650 | | 0. |
‡aElectronics. |
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| 650 | | 0. |
‡aSystems engineering. |
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| 650 | | 0. |
‡aOptical materials. |
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| 650 | 1 | 4. |
‡aEngineering. |
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| 650 | 2 | 4. |
‡aElectronics and Microelectronics, Instrumentation. |
|---|
| 650 | 2 | 4. |
‡aOptical and Electronic Materials. |
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| 650 | 2 | 4. |
‡aContinuum Mechanics and Mechanics of Materials. |
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| 650 | 2 | 4. |
‡aCircuits and Systems. |
|---|
| 710 | 2 | . |
‡aSpringerLink (Online service) |
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| 773 | 0 | . |
‡tSpringer eBooks |
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| 776 | 0 | 8. |
‡iPrinted edition:
‡z9781461404620 |
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| 856 | 4 | 0. |
‡uhttp://biblioteca.ipicyt.edu.mx:2048/login?url=http://dx.doi.org/10.1007/978-1-4614-0463-7
‡yTexto completo
‡9CONS |
|---|
| 950 | | . |
‡aEngineering (Springer-11647) |
|---|
| 901 | | . |
‡a25962
‡b
‡c25962
‡tbiblio
‡sSystem Local |
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