E-book
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Record details
- ISBN: 9783319023786
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Physical Description:
electronic
electronic resource
access
remote
XVIII, 245 p. 133 illus., 115 illus. in color. online resource. - Publisher: Cham : Springer International Publishing : Imprint: Springer, 2014.
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| Subject: | Engineering Computer science Systems engineering Engineering Circuits and Systems Processor Architectures Semiconductors |
