E-book
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs [electronic resource] / by Brandon Noia, Krishnendu Chakrabarty.
Record details
- ISBN: 9783319023786
- Physical Description: XVIII, 245 p. 133 illus., 115 illus. in color. online resource.
- Publisher: Cham : Springer International Publishing : 2014.
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