E-book
Advanced Flip Chip Packaging [electronic resource] / edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong.
Record details
- ISBN: 9781441957689
- Physical Description: VII, 560 p. 413 illus., 242 illus. in color. online resource.
- Publisher: Boston, MA : Springer US : 2013.
Search for related items by subject
| Subject: | Engineering. Electronics. Systems engineering. Optical materials. Engineering. Electronics and Microelectronics, Instrumentation. Circuits and Systems. Optical and Electronic Materials. |
