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Force Sensors for Microelectronic Packaging Applications Cover Image E-book E-book

Force Sensors for Microelectronic Packaging Applications [electronic resource] / by Jürg Schwizer, Michael Mayer, Oliver Brand.

Schwizer, Jürg. (author.). Mayer, Michael. (author.). Brand, Oliver. (author.). SpringerLink (Online service) (Added Author).

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  • ISBN: 9783540269458
  • Physical Description: VIII, 178 p. 149 illus. online resource.
  • Publisher: Berlin, Heidelberg : Springer Berlin Heidelberg, 2005.

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Subject: Chemistry.
System safety.
Electronics.
Optical materials.
Nanotechnology.
Chemistry.
Nanotechnology.
Optical and Electronic Materials.
Physics and Applied Physics in Engineering.
Quality Control, Reliability, Safety and Risk.
Electronics and Microelectronics, Instrumentation.

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Texto completo

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1001 . ‡aSchwizer, Jürg. ‡eauthor.
24510. ‡aForce Sensors for Microelectronic Packaging Applications ‡h[electronic resource] / ‡cby Jürg Schwizer, Michael Mayer, Oliver Brand.
264 1. ‡aBerlin, Heidelberg : ‡bSpringer Berlin Heidelberg, ‡c2005.
300 . ‡aVIII, 178 p. 149 illus. ‡bonline resource.
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65014. ‡aChemistry.
65024. ‡aNanotechnology.
65024. ‡aOptical and Electronic Materials.
65024. ‡aPhysics and Applied Physics in Engineering.
65024. ‡aQuality Control, Reliability, Safety and Risk.
65024. ‡aElectronics and Microelectronics, Instrumentation.
7001 . ‡aMayer, Michael. ‡eauthor.
7001 . ‡aBrand, Oliver. ‡eauthor.
7102 . ‡aSpringerLink (Online service)
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830 0. ‡aMicrotechnology and MEMS, ‡x1615-8326
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