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Bonding in Microsystem Technology Cover Image E-book E-book

Bonding in Microsystem Technology

Dziuban, Jan A. (author.). SpringerLink (Online service) (Added Author).

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  • ISBN: 9781402045899
  • Physical Description: electronic
    electronic resource
    access
    remote
    XVIII, 331 p. 296 illus. online resource.
  • Publisher: Dordrecht : Springer Netherlands, 2006.

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Subject: Engineering
Materials
Structural control (Engineering)
Electronics
Optical materials
Engineering
Continuum Mechanics and Mechanics of Materials
Physics and Applied Physics in Engineering
Optical and Electronic Materials
Electronics and Microelectronics, Instrumentation
Operating Procedures, Materials Treatment

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▼ MARC Record
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