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Bonding in Microsystem Technology Cover Image E-book E-book

Bonding in Microsystem Technology [electronic resource] / by Jan A. Dziuban.

Dziuban, Jan A. (author.). SpringerLink (Online service) (Added Author).

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LDR 01793nam a22004815i 4500
00112520
003CONS
00520131218190450.0
007cr nn 008mamaa
008100301s2006 ne | s |||| 0|eng d
020 . ‡a9781402045899 ‡9978-1-4020-4589-9
0247 . ‡a10.1007/1-4020-4589-1 ‡2doi
035 . ‡a(DE-He213)978-1-4020-4589-9
050 4. ‡aTA405-409.3
050 4. ‡aQA808.2
072 7. ‡aTG ‡2bicssc
072 7. ‡aTEC009070 ‡2bisacsh
072 7. ‡aTEC021000 ‡2bisacsh
1001 . ‡aDziuban, Jan A. ‡eauthor.
24510. ‡aBonding in Microsystem Technology ‡h[electronic resource] / ‡cby Jan A. Dziuban.
264 1. ‡aDordrecht : ‡bSpringer Netherlands, ‡c2006.
300 . ‡aXVIII, 331 p. 296 illus. ‡bonline resource.
336 . ‡atext ‡btxt ‡2rdacontent
337 . ‡acomputer ‡bc ‡2rdamedia
338 . ‡aonline resource ‡bcr ‡2rdacarrier
347 . ‡atext file ‡bPDF ‡2rda
4901 . ‡aSpringer Series in Advanced Microelectronics, ‡x1437-0387 ; ‡v24
650 0. ‡aEngineering.
650 0. ‡aMaterials.
650 0. ‡aStructural control (Engineering).
650 0. ‡aElectronics.
650 0. ‡aOptical materials.
65014. ‡aEngineering.
65024. ‡aContinuum Mechanics and Mechanics of Materials.
65024. ‡aPhysics and Applied Physics in Engineering.
65024. ‡aOptical and Electronic Materials.
65024. ‡aElectronics and Microelectronics, Instrumentation.
65024. ‡aOperating Procedures, Materials Treatment.
7102 . ‡aSpringerLink (Online service)
7730 . ‡tSpringer eBooks
77608. ‡iPrinted edition: ‡z9781402045783
830 0. ‡aSpringer Series in Advanced Microelectronics, ‡x1437-0387 ; ‡v24
85640. ‡uhttp://biblioteca.ipicyt.edu.mx:2048/login?url=http://dx.doi.org/10.1007/1-4020-4589-1 ‡yTexto completo ‡9CONS
950 . ‡aEngineering (Springer-11647)
901 . ‡a12520 ‡b ‡c12520 ‡tbiblio ‡sSystem Local

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