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Advanced Materials for Thermal Management of Electronic Packaging Cover Image E-book E-book

Advanced Materials for Thermal Management of Electronic Packaging

Tong, Xingcun Colin. (Author). SpringerLink (Online service) (Added Author).

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  • ISBN: 9781441977595
  • Physical Description: electronic
    electronic resource
    access
    remote
    XXI, 550p. 116 illus., 50 illus. in color. digital.
  • Edition: 1.
  • Publisher: New York, NY : Springer New York, 2011.

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Subject: Physics
Engineering
Electronics
Optical materials
Physics
Electronic Circuits and Devices
Optical and Electronic Materials
Engineering Thermodynamics, Heat and Mass Transfer
Electronics and Microelectronics, Instrumentation

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