E-book
Designing TSVs for 3D Integrated Circuits
Record details
- ISBN: 9781461455080
- Physical Description: X, 76 p. 34 illus., 29 illus. in color. online resource.
- Publisher: New York, NY : Springer New York : 2013.
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| Subject: | Engineering. Computer science. Electronics. Systems engineering. Engineering. Circuits and Systems. Processor Architectures. Electronics and Microelectronics, Instrumentation. |
