Designing TSVs for 3D Integrated Circuits

Khan, Nauman. (author.). Hassoun, Soha. (author.). SpringerLink (Online service) (Added Author).

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• ISBN: 9781461455080
• Physical Description: electronic
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  X, 76 p. 34 illus., 29 illus. in color. online resource.
• Publisher: New York, NY : Springer New York : 2013.

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• SpringerBriefs in Electrical and Computer Engineering