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Materials for Information Technology Devices, Interconnects and Packaging Cover Image

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Materials for Information Technology Devices, Interconnects and Packaging

Zschech, Ehrenfried. (editor.). Whelan, Caroline. (editor.). Mikolajick, Thomas. (editor.). SpringerLink (Online service) (Added Author).

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ISBN: 9781846282355
Physical Description: XIX, 508 p. 338 illus. online resource.
Publisher: London : Springer London, 2005.

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Subject:

Engineering.
Particles (Nuclear physics).
Electronics.
Materials.
Surfaces (Physics).
Engineering.
Physics and Applied Physics in Engineering.
Electronics and Microelectronics, Instrumentation.
Solid State Physics and Spectroscopy.
Ceramics, Glass, Composites, Natural Methods.
Surfaces and Interfaces, Thin Films.
Metallic Materials.

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