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Materials for Information Technology Devices, Interconnects and Packaging Cover Image

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Materials for Information Technology [electronic resource] : Devices, Interconnects and Packaging / edited by Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick.

Zschech, Ehrenfried. (editor.). Whelan, Caroline. (editor.). Mikolajick, Thomas. (editor.). SpringerLink (Online service) (Added Author).

Record details

ISBN: 9781846282355
Physical Description: XIX, 508 p. 338 illus. online resource.
Publisher: London : Springer London, 2005.

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Subject:

Engineering.
Particles (Nuclear physics).
Electronics.
Materials.
Surfaces (Physics).
Engineering.
Physics and Applied Physics in Engineering.
Electronics and Microelectronics, Instrumentation.
Solid State Physics and Spectroscopy.
Ceramics, Glass, Composites, Natural Methods.
Surfaces and Interfaces, Thin Films.
Metallic Materials.

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