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Materials for Information Technology Devices, Interconnects and Packaging  Cover Image E-book E-book

Materials for Information Technology Devices, Interconnects and Packaging

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  • ISBN: 9781846282355
  • Physical Description: electronic
    electronic resource
    access
    remote
    XIX, 508 p. 338 illus. online resource.
  • Publisher: London : Springer London, 2005.
Subject: Engineering
Particles (Nuclear physics)
Electronics
Materials
Surfaces (Physics)
Engineering
Physics and Applied Physics in Engineering
Electronics and Microelectronics, Instrumentation
Solid State Physics and Spectroscopy
Ceramics, Glass, Composites, Natural Methods
Surfaces and Interfaces, Thin Films
Metallic Materials

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