Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Noia, Brandon. (author.). Chakrabarty, Krishnendu. (author.). SpringerLink (Online service) (Added Author).

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• ISBN: 9783319023786
• Physical Description: electronic
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  XVIII, 245 p. 133 illus., 115 illus. in color. online resource.
• Publisher: Cham : Springer International Publishing : 2014.

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