E-book
Advanced Flip Chip Packaging
Record details
- ISBN: 9781441957689
- Physical Description: VII, 560 p. 413 illus., 242 illus. in color. online resource.
- Publisher: Boston, MA : Springer US : 2013.
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| Subject: | Engineering. Electronics. Systems engineering. Optical materials. Engineering. Electronics and Microelectronics, Instrumentation. Circuits and Systems. Optical and Electronic Materials. |
