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Wafer Level 3-D ICs Process Technology Cover Image E-book E-book

Wafer Level 3-D ICs Process Technology

Tan, Chuan Seng. (editor.). Gutmann, Ronald J. (editor.). Reif, L. Rafael. (editor.). SpringerLink (Online service) (Added Author).

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  • ISBN: 9780387765341
  • Physical Description: XII, 410p. online resource.
  • Publisher: Boston, MA : Springer US, 2008.

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Subject: Engineering.
Electronics.
Optical materials.
Surfaces (Physics).
Engineering.
Electronics and Microelectronics, Instrumentation.
Optical and Electronic Materials.
Surfaces and Interfaces, Thin Films.
Engineering, general.

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